Xiaomi XRING O3 chip hits 5.22 million AnTuTu, first with LPDDR6

Xiaomi's XRING O3, manufactured on TSMC's 3nm node, is the first smartphone processor to support LPDDR6 memory, posting a 5.22 million AnTuTu v11 score that challenges Qualcomm and MediaTek at the flagship tier.

"The XRING O3 is a dedicated project completed over 459 days," Lei Jun, founder, chairman and chief executive of Xiaomi, said at the chip briefing.

The SoC packs 24 billion transistors, 26 percent more than its predecessor, into a 133mm² die. Its 10-core all-big-core CPU — two C1-Ultra cores at 4.35GHz, four C1-Premium cores at 3.68GHz and four C1-Pro cores at 3.15GHz — delivers a 60 percent peak performance gain, with multi-core Geekbench scores topping 15,000 for the first time. The 16-core G2-Ultra NX GPU lifts graphics performance 85 percent while cutting power draw 64 percent, and the redesigned NPU delivers 200 TOPS of tensor compute for Xiaomi's on-device MiMo models, a 45 percent jump in AI performance. Memory bandwidth reaches 113.8GB/s, up 48 percent from the XRING O1, with an 82-nanosecond latency that Xiaomi says beats Apple's A19 Pro.

Xiaomi shares fell 4 percent in Hong Kong trading despite the launch, with short selling at 27.69 percent of turnover, suggesting the market had already priced in the chip's arrival. The in-house silicon, which also includes the XRING O100 AI accelerator and the XRING D100 autonomous-driving chip, cuts Xiaomi's reliance on Qualcomm and MediaTek and could lift gross margins across its premium smartphone and EV lines.

LPDDR6 Support Sets a New Memory Bar

The XRING O3 is the industry's first mobile processor designed for LPDDR6 RAM, running at 10,667Mbps across a 4×24-bit bus. Xiaomi's Xuanjie unified integration protocol cuts protocol-conversion overhead by up to 75 percent, shortening physical interconnect paths through high-layer metal traces and intelligent memory prefetching. The 82-nanosecond latency figure, if confirmed, would surpass Apple's A19 Pro and mark a 54 percent improvement over the XRING O1. Xiaomi did not disclose the test conditions for the latency comparison.

Three Chips, One Silicon Strategy

The XRING O3 is one of three in-house chips Xiaomi unveiled. The XRING O100, an AI accelerator for on-device large models, uses the industry's first 6nm wafer-on-wafer 3D packaging with hybrid bonding at a 1.4-micron pitch, delivering 1.22TB/s of bandwidth and 330 tokens per second of inference speed. The XRING D100, China's first 3nm high-compute AI chip for autonomous driving, pairs a 20-core CPU with a 16-core NPU and supports 160GB of unified memory, enough to run models with 200 billion parameters locally. Development of both is complete, with the D100 slated for commercial deployment next year.

The XRING O3 enters volume production and debuts in the Xiaomi 18 Fold, launching in September, and the Xiaomi Pad 9 Pro Max. Reuters reported, citing sources, that TSMC will produce the chip on its 3nm process with a target of 200,000 to 300,000 units. Xiaomi introduced the XRING O1 and XRING T1 in May last year, with the O1 powering the Xiaomi 15S Pro and Xiaomi Pad 7 series. The O3 marks a flagship chip iteration completed in 459 days, accelerating Xiaomi's push to reduce dependence on Qualcomm and MediaTek. The three-chip lineup helps amortize research and development costs across Xiaomi's "Human x Car x Home" product lines, though scaled deployment may push up near-term R&D spending before margins improve.

This article is for informational purposes only and does not constitute investment advice.