Hi-Lex Corporation has an annual dividend of 43.3403 per share, with a yield of 0.00%. The dividend is paid semi-annually and the last ex-dividend date was Oct 30, 2025.
Dividend Yield
Annual Dividend
Ex-Dividend Date
0.00%
$43.3403
Oct 30, 2025
Payout Frequency
Payout Ratio
Semi-annually
0.00%
Dividend History
Ex-Dividend Date
Cash Amount
Record Date
Pay Date
Oct 30, 2025
$23.00
Oct 31, 2025
Jan 1, 2026
Apr 28, 2025
$23.00
Apr 30, 2025
Jul 1, 2025
Oct 30, 2024
$20.00
Oct 31, 2024
Jan 27, 2025
Apr 26, 2024
$20.00
Apr 30, 2024
Jul 1, 2024
Oct 30, 2023
$17.00
Oct 31, 2023
Jan 29, 2024
Apr 27, 2023
$17.00
Apr 30, 2023
Jul 3, 2023
Dividend Charts
HLXFF Dividends
HLXFF Dividend Growth (YoY)
Follow-Up Questions
What is Hi-Lex Corporation's current dividend paid and annual dividend?
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Key Stats
Prev.Close
$7.82
Open
$7.83
Day's Range
$7.82 - $7.82
52 week range
$7.82 - $7.82
Volume
6.2K
Avg.Volume
0
EPS (TTM)
-1.34
Dividend yield
--
Market Cap
$289.0M
What is HI-LEX CORPORATION?
Hi-Lex Corp. engages in the manufacture and sale of control cables and systems for automobiles, industrial equipment, medical devices, and metal molds. The company is headquartered in Takarazuka-Shi, Hyogo-Ken. The firm has six geographical segments: Japan, North America (United States and Mexico), China, Asia (mainly South Korea, Indonesia and India), South America and Europe (United Kingdom, Hungary, Russia, Germany) based on the production and sales systems. The Japan segment is also engaged in the production and sale of medical equipment, besides control systems. The Europe segment is also engaged in the design, sale, purchasing and testing of western manufacturers for global models besides control systems.