July's Korean memory crash erased ₩553 trillion in market value, but the deeper story is a repricing of how the AI supply chain makes money.
July's Korean memory crash erased ₩553 trillion in market value, but the deeper story is a repricing of how the AI supply chain makes money.

SK Hynix shares fell 47 percent and Samsung Electronics 38 percent in July, wiping roughly ₩553 trillion ($385 billion) in combined Korean market value as leveraged retail positions unwound — the sharpest test yet of the AI memory supercycle.
"The adjustment is not a full reversal of AI demand logic but a structural risk release starting from the Korean memory sector," analysts led by Huang Wentao, chief economist at China Securities, wrote in a July 31 note.
The crash followed record earnings. SK Hynix posted a second-quarter operating profit of ₩60.54 trillion, up 557 percent year over year with a 76 percent operating margin; Samsung's ₩89.5 trillion quarterly profit exceeded its combined earnings from 2023 through 2025; Micron's gross margin reached 84.6 percent. Yet the marginal pricing power that drove those numbers is fading — DRAM contract price increases are projected to slow from 90-95 percent quarter over quarter in Q1 to 13-18 percent in Q3, with NAND following a similar trajectory from 70-75 percent to 10-15 percent.
The question for the second half is whether the AI supply chain shifts from price-driven to volume-driven growth. Cloud providers Meta, Alphabet, Amazon and Microsoft have committed roughly $725 billion in combined 2026 capital expenditure, up 77 percent from 2025, and memory manufacturers are pivoting from supply discipline to capacity expansion — a strategic shift that could compress margins even as AI infrastructure buildout accelerates.
The mechanics of the July crash were specific to Korea's retail market. Individual investors stacked credit loans, securities-backed financing, and single-stock leveraged ETFs on top of each other, creating what China Securities called a "mutually reinforcing leverage structure." SK Hynix and Samsung together reached roughly 60 percent of the KOSPI index weight by late June, up from about one-third in March, and contributed about 70 percent of the index's 2026 gains. When prices turned, forced liquidation cascaded through the market.
The unwind is still incomplete. Citigroup estimates that only about 65 percent of the credit financing positions accumulated since the start of the year have been liquidated, with ₩32.7 trillion still outstanding. Korean-domiciled leveraged ETF market capitalization has collapsed from a $52.5 billion peak to about $19 billion, with estimated retail losses of roughly $38.7 billion. The KOSPI's record 17.91 percent single-day gain on July 31 released short-term oversold momentum, but bank time deposits surged by over ₩24 trillion in a single month as capital fled equities for safety.
The more consequential shift is happening at the manufacturer level. SK Group chairman Choi Tae-won said AI semiconductor prices are at "abnormally high levels" and warned that continued increases could trigger "chip inflation" that compresses downstream demand — a striking admission from the head of the world's largest memory maker. The strategic response is a pivot from supply discipline toward capacity expansion and long-term contracts.
SK Hynix has signed a multi-year agreement with NVIDIA covering co-development of HBM4-class AI memory, part of a $500 billion-plus AI infrastructure framework between SK Group and NVIDIA that includes a 2-gigawatt data center. Samsung and Broadcom have agreed to a five-year cooperation framework spanning memory, foundry, and advanced packaging. Micron has signed 16 strategic customer agreements, most with binding take-or-pay mechanisms. Capital expenditure is rising in parallel: SK Hynix plans to double wafer capacity over five years, Micron has raised FY2026 capex from about $180 billion to $270 billion, and TSMC lifted its 2026 guidance from $540 billion to $620 billion.
The tension is that new capacity takes time. Fab construction, equipment installation, and yield ramp mean the supply response will not arrive until 2027 at the earliest — TrendForce projects DRAM will remain undersupplied through 2028, with the sufficiency ratio widening further in 2027. The near-term picture is therefore one of prices holding but the slope of increases flattening, while the market reweights toward order visibility, delivery execution, and volume growth.
For investors, the repricing has already begun. The market is no longer paying for pure price elasticity — it wants proof of volume delivery. That favors companies with confirmed order books and capacity expansion plans: TSMC, Advantest, Teradyne in advanced packaging and test; Lumentum, Broadcom, Arista in optical and switching; Vertiv and GE Vernova in power and cooling. Pure price-mapping plays in CCL, MLCC, and memory modules face the highest risk of disappointment as the market demands evidence of real demand absorption.
China's CXMT is the wildcard. Listed July 27, the DRAM maker's shares have surged 510 percent, with market share climbing from 3 percent in Q1 2025 to 8 percent in Q1 2026. Analyst Jim Handy of Objective Analysis told National Business Daily that CXMT is positioned to establish a firm foothold in DRAM, though he cautioned that AI capital investment will eventually hit a stagnation period that could trigger a price crash and force a player out of the market.
The second half of 2026 will test whether the AI supply chain can transition from a price supercycle to a volume supercycle without breaking. Cloud capex remains the anchor — Amazon alone raised its 2026 forecast to $220 billion, citing rising memory costs as a primary driver. But with memory now consuming 20 percent or more of smartphone bill of materials and Chinese handset makers OPPO and vivo rejecting Samsung's proposed Q3 pricing, the downstream tolerance for further increases is finite.
This article is for informational purposes only and does not constitute investment advice.