The insatiable demand for artificial intelligence is creating a new class of winners in the chip supply chain, with some component makers seeing a 15-fold increase in demand for parts essential to building AI servers.
"A single AI server's demand for multi-layer ceramic capacitors (MLCCs) is 10 to 15 times that of a standard server," according to analysis from Pictet Asset Management senior investment manager Young Jae Lee.
This demand surge has pushed production utilization for MLCCs and advanced substrates above 90 percent, according to a Bank of America Global Research report. The supply tightness is leading to upward price pressure, with Samsung Electro-Mechanics confirming this week it is considering raising MLCC prices by as much as 10 percent.
The supply crunch has ignited a rally in supplier stocks, with substrate maker Unimicron soaring about 770 percent and Japan's Ibiden jumping 530 percent over the past 12 months. The gains show how investors are looking deeper into the AI value chain beyond headline names like Nvidia.
The New AI Bottleneck
The core issue is the immense power consumption of AI servers. Higher power requires more, and higher-quality, components to manage and stabilize the electricity flowing through the system. This creates a ripple effect down the supply chain, benefiting manufacturers of previously overlooked parts.
The key components benefiting from this boom include:
- Multi-Layer Ceramic Capacitors (MLCCs): These tiny parts are crucial for regulating power flow within an electronic system. An AI server needs thousands of them.
- Advanced Substrates: These act as the connecting interface between the semiconductor and the rest of the hardware.
- Thermal Compression Bonding (TCB): This is a critical process used in advanced packaging to bond the chip components together.
"If AI demand sees just a slight additional increase, the available production capacity for traditional uses will sharply contract," said Simon Woo, head of Korea research at Bank of America Global Research.
A Broader Infrastructure Overhaul
The component squeeze is part of a larger story of AI forcing a complete overhaul of data center infrastructure. At the Data Center World conference, experts from Omdia and Vertiv noted that the industry is grappling with power, cooling, and supply chain challenges simultaneously.
The shift is most evident in the move to liquid cooling. Omdia projects that the volume of liquid-cooled chips will increase fivefold between 2025 and 2030, with liquid cooling capacity set to double that of air cooling by the end of 2026. Even so, air cooling will remain necessary for other components in the rack.
For investors, the AI buildout is a multi-layered opportunity. While GPU makers have seen massive gains, the sustained, high-margin growth may now come from the less glamorous but equally essential component suppliers. The stock performance of companies like Murata Manufacturing and Hanmi Semiconductor, both of which have hit record highs, suggests the market is pricing in a prolonged period of supply tightness. The pricing power, as Aberdeen Investments' Kieron Poon noted, "will undoubtedly remain in the hands of the suppliers."
This article is for informational purposes only and does not constitute investment advice.